The upper contact areas are located above the lower contact areas.

The second electrical connections includes a second plurality of contact areas, which are distinct from the first contact areas.

A plurality of conducting means (5) provide electrical contact between the chip contact areas (3) and the first contact areas (6).

The working electrode further includes working areas and contact areas.

All contact areas are substantially identical.

The source regions (64), the diode contact regions (78), and the drain contact regions (76) are electrically connected to corresponding common terminals.

The end faces of the contact pillars completely cover the contact locations.

The user interface includes a plurality of contact areas.

The contact areas have a first and second contact sections being shorted together.

A nickel coating is formed on the contact pads and the connector pads, and a gold layer is formed on the nickel coating on the contact pads and the connector pads.

The electrical connections include first contact areas.

Each surface incorporates electrical contact pads.

The card is provided with a set of contact areas.

At least one contact (126) is held in each of the plurality of contact zones.

This makes it possible to press the solder between the contact pillars and contact locations after renewed heating completely from the intermediate region between the contact locations and the contact pillars.