A current thief is located adjacent to the curved upper surface.
A cathode current control system employing a current thief (95) for use in electroplating a wafer (55) is set forth.
The current thief (95) comprises a plurality of conductive segments (130) disposed to substantially surround a peripheral region of the wafer (55).
Various constructions are used for the current thief (95) and further conductive elements, such as fingers (235), may also be employed in the system.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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