The PCM structure includes a metal structure and a photonic crystal structure disposed adjacent the metal structure.

The metal support is preferably a porous metal structure, such as a metal mesh or foam.

The device comprises a metal structure with at least one self-assembled metal dendrite and forming an interconnect element (424) between a first and a second metal structure.

The integrated circuit also includes a metal structure.

To bond a metallic structure (14) to a thermoplastic composite structures (16), the bonding surface of the metallic fitting is consolidated with the thermoplastic composite structure (50).

A welded laminate metal structure is also provided herein.

The present specification provides a metal structure comprising a base, a metal layer, and a color-adjusting layer.

The process provides for the fabrication of a solid, single-piece and open body which comprises said first layer (2), second layer (3) and third layer (4), the latter covering a metal structure (5) of reinforcement.

The antenna also comprises a metal structure attached to the dielectric substrate.

A metal frame of a dental product is cast in mold cavity.

A metal structure for a contact pad of an integrated circuit (IC), which has copper interconnecting metallization (311).

A metal interconnection structure of cross-under interconnection formed on a pnpn structure is provided for prevention of latchup.

A core for an airfoil includes a refractory metal structure having a variable thickness.

An improved method for welding a laminated metal structure is presented herein.

The metallic element (2) may be a metallic anchoring element which secures said refractory lining to a metallic structure.