The invention relates to a punching die holder which has a pressure plate (12) arranged below a die retaining plate (14).

The friction wedges are in contact with a base plate.

A temporary holding stage (35) is disposed at intervals above a rotating stage (33) that implements an alignment process on the tray (3) before conveyance into a plasma-treatment unit (11).

The system includes a workpiece support within the reaction space.

A support plate is arranged on top of the heat conducting layer, comprising a recess and several electrical conductor tracks.

A process is disclosed for removing electronic components from a support board for repair purposes, in particular integrated circuits applied with an adhesive on the support board.

According to said method, a carrier board (TP) is equipped with memory components (SB).

The invention relates to a method for producing memory modules (SM).

At least one platen is disposed on the platen support member, the platen adapted for lateral positioning along the platen support member.

A faceplate (164) is coupled to the base mount.

The platen may receive a sheet of print media.

The invention relates to a punching die holder which has a pressure plate (12) arranged below a die retaining plate (14).

A sample holder assembly includes a sample tray, a base plate, a stage mount, and a calibration standard mounted onto the stage mount.

The friction wedges are in contact with a base plate.

The support rests on a plate (P) with the aid of damping means (A) that allow for dampened displacement of the support in relation to the plate in an exclusively vertical direction.