The method creates various bump structures by varying an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump.

A nanostructure bump is formed on a die.

The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity.

A bump is formed over the second wirebond, and the bump is offset from the second wirebond.

The coupling includes a bump (210) and a pad (220).

The can also includes a cap (4) with a dent (5).

The fastener includes a boss with a threaded opening on one of the jaws, which boss is received by an opening in the other of the jaws.

[Solution] A bump bonding pad (61) is disposed at an upper surface of a substrate (45), and a bump (70) of a circuit element (43) is connected to the bump bonding pad (61).

A under-bump metallization layer is disposed in the opening and a solder bump overlies the metallization layer.

In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump.

If more than one hunch is present the first hunch is the hunch positioned closest to the tip; if only one hunch is present this hunch is the first hunch.

According to the invention, said contact bump structure comprises a tin bump (8) formed by means of an autocatalytic reaction on said contact pad area (3).

A bump or lump on the back of the head is often due to an injury.

This can sometimes feel like a lump or bump in your throat.

The pipe joint includes a spigot terminating in an inverted hump supporting an elastomeric seal wherein the inverted hump is spaced from a protruding hump.