The hole may be a blind hole or a through hole.
The through hole is smaller than the center hole.
The hole includes a through hole and a thin part in contact with the through hole.
The through hole conductor is formed within the through hole.
The auxiliary hole may be a through hole or a blind hole.
A hole sealing method for a conductive through-hole and a hole-sealed product.
A method for producing a printed circuit board (10) is described A substrate (12) having a via (16) is provided with the via being coated with a conductive layer defining a perimeter of the via.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Traduction Translation Traducción Übersetzung Tradução Traduzione Traducere Vertaling Tłumaczenie Mετάφραση Oversættelse Översättning Käännös Aistriúchán Traduzzjoni Prevajanje Vertimas Tõlge Preklad Fordítás Tulkojumi Превод Překlad Prijevod 翻訳 번역 翻译 Перевод