At least one of the substrates has a deformation temperature below the activation temperature of the adhesive.
The separator has a higher thermal deformation temperature than the resin layer.
The heat resistant resin exhibits a thermal deformation temperature of 160°C or higher.
The glass must be gradually cooled to a temperature below the deformation temperature.
The degree of strengthening after cold deformation varies with the degree of deformation, deformation temperature and the nature of the material itself.
The heat distortion temperature of the composites approaches that of the crystal melting temperature of the matrix polymer.
The composition also often exceeds a threshold of 65° C in heat deflection temperature.
The composition also often exceeds a threshold of 65°C in heat deflection temperature.
The degree of strengthening after cold deformation varies with the degree of deformation, the temperature of deformation, and the nature of the material itself.
The optical glass exhibits a low incipient deformation point and has good chemical durability.
Traditionally, this is the deflection temperature under load (DTUL), also called the heat deflection temperature (HDT).
B: a second liquid crystalline polyester having a lower heat deflection temperature than that of the first liquid crystalline polyester.
The degree of strengthening after cold deformation varies with the degree of deformation, the temperature of deformation, and the nature of the material itself.
Polymerizable compositions comprising epichalcogen resin, polythiol, and cyclic anhydride are useful for preparing polymerizates of high refractive index and high heat distortion temperature.
The resulting bioderived plasticizer lowers glass transition temperature (Tg), can improve brittleness, may increases heat deflection temperature and improves melt viscosity.
The modified bulb shield reduces the maximum temperature requirements of headlamp assemblies thereby enabling lower HDT plastic materials to be used in the headlamp assembly.
When these same alkenyl aromatic polymer foams are made without these interpolymers, the heat distortion temperature is not improved.
The workpiece is swept with at least one window of microwave frequencies selected to heat the adhesive without heating the substrates above their respective deformation temperatures.
It is thus possible to reduce the forming temperature by at least 300 °C, wherein processing is possible on conventional systems.
The present invention provides a low softening temperature, fast-setting adhesive package that exhibits high ultimate temperature performance.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Traduction Translation Traducción Übersetzung Tradução Traduzione Traducere Vertaling Tłumaczenie Mετάφραση Oversættelse Översättning Käännös Aistriúchán Traduzzjoni Prevajanje Vertimas Tõlge Preklad Fordítás Tulkojumi Превод Překlad Prijevod 翻訳 번역 翻译 Перевод