The present invention concerns a food product which is in a gel phase at room temperature and which is converted to a liquid phase at a temperature elevated above room temperature.

It is heated to a temperature above that of the power gas.

The less heat sensitive component is heated to a temperature higher than a sterilising temperature.

The power gas flows around the measuring unit (11).

Subsequently the obtained compacted component is optionally heated to a temperature above the curing temperature.

This grain structure is obtained if annealing processes above some 950 °C are avoided.

The lubricant is applied by preheating the partially completed flexible shaft to a temperature substantially above 212°F but below the decomposition temperature of the lubricant.

Preferably, in step (4), the temperature of the hollow balls (4) is increased to a temperature exceeding the dew point of the external air.

The inert gas or mold or both can be heated to a temperature above room temperature.

Dried powder is heated at a temperature exceeding 90°C for at least 10 minutes.

Polymerization is capable of being initiated at a temperature considerably above the temperature or the temperatures achieved during the manufacture and storage of the arrangement.

Then the semiconductor layer is annealed at a temperature that exceeds a thermal stability temperature of the defects to cause a healing thereof.

However, temperatures rising above the following thresholds may be indicative of a fever.

After impregnation of the substrate, the diyne is polymerized to provide a blue product, which upon being heated above a transition temperature turns ro red.

Novel polyarylamide derived activated carbon materials are provided by a process comprising the carbonization of polyarylamide fibre at a temperature in excess of 400 °C followed by activation at elevated temperature.