The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units.
An integrated circuit power supply interconnection technique having a highly doped, low resistivity substrate (17) for distribution of the integrated circuit's most positive supply voltage.
An embodiment of the present invention is an interconnect technique.
To a large extent, this problem of irrationality is described as a social coordination problem.
An embodiment of the present invention is an interconnect technique.
A technique for implementing a virtual private optical switched transport network using virtual private optical cross-connect technology is disclosed.
A system and a method for visualizing a communication network interconnecting technical equipment of a power plant are presented.
A technique for interconnecting monolithic microwave integrated circuits (MMICs) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection.
An interconnecting technique wherein the connections between components are made by wires routed between connecting points.
POINT-TO-POINT WIRINGAn interconnecting technique wherein the connections between components are made by wires routed between connecting points.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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