The polishing head includes an elastic polishing pad mounted on an elastic membrane that seals a cavity in the polishing head.

A polishing head (63) is connected to the drive mechanism (45) for driving rotation of the polishing head.

Also provided is a polishing apparatus, which is equipped with the polishing head.

The polishing head thus prepared and the polishing apparatus accomplish a constant flatness and a constant polishing allowance.

The present invention is directed, in general, to a polishing pad comprising a polishing body.

The electrostatic flocking material on the polishing head (20b) at least temporarily increases the retention of the polishing material on the polishing head (20b), thereby deceasing splattering.

The apparatus includes a polishing head for positioning a surface of a substrate against polishing surface of the apparatus.

The inventive polishing head comprises a polishing plate that is linked with a rotation-driven primary shaft.

In another embodiment, the buff pad is circular and is the same size as the circular buff head.

A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine is formed of a flexible pad.

The shaft (260) is rotatable to spin the polishing head (250) and polishing pad (117) around the shaft axis (270).

Accordingly, lapping and final polishing can be successively conducted using the same polishing head.

The drive mechanism rotates a rotating body installed on a polishing pad, and revolves and translates a polishing head on the polishing pad.

Thus, a polishing head is provided with which the overall shape of the workpiece can be freely controlled by polishing.

A force distributing member intermediate the polisher head and the pressure plate is constructed for uniformly distributing the force applied by the polisher head to the pressure plate.