A protective tape (14) is stuck to the surface of the semiconductor wafer (16) and the adsorption surface (12) of the adsorption plate (18) is made to abut against the protective tape (14).
A sealing component (16) is disposed on an adsorption surface of the suction cup (2).
Provided is a solder piece such that a surface on which a rounded part arising in punch processing is formed does not form an adsorption surface.
The acid and/or acid salt has the property of being adsorbed onto the hydrophilic non-image areas to enable the adsorption surface to be wetted with the dampening water.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Traduction Translation Traducción Übersetzung Tradução Traduzione Traducere Vertaling Tłumaczenie Mετάφραση Oversættelse Översättning Käännös Aistriúchán Traduzzjoni Prevajanje Vertimas Tõlge Preklad Fordítás Tulkojumi Превод Překlad Prijevod 翻訳 번역 翻译 Перевод