With respect to the electrode structure for external connection, protruding parts of high temperature solder are formed for the adaption to the surface mounting.

A solder layer as a substitute for a high-temperature solder which bonds a functional-part package to a lid and has a solidus temperature of 250°C or higher.

This solder layer functions as a high-temperature solder because the intermetallic compound is bonded to the material difficult to solder and particles of the intermetallic compound are connected to one another.

High temperature solder and larger silicon elements are incorporated to enable faster and more uniform cooling.

The scheme of high-temperature soldering of bronze: 1 - torch movement; 2 - bar movement; 3 - movement of the burner and rod.

The scheme of high-temperature soldering of cast iron: 1 - movement of the burner; 2 - bar movement; 3 - movement of the burner and rod.