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Soldering of planar microcircuits in the SOIC package

On electronic cards, there are often microcircuits with a SOIC package.

The magnetic sensor includes a compact integrated circuit package (124) such as, for example, a small outline integrated circuit package (SOIL).

For instance, component packages such as 0603 or SOICs with a 0.020” pitch require rather thin solder paste stencils, whereas a thicker stencil is more suitable for components such as 1206 or SOICs of 0.050” pitch.

The IRS21681D and IRS2168D are both available in either 16- pin PDfP or 16-pin narrow body SOIC packages.

The sockets can also be used in a conventional manner to socket integrated circuit compnents such as SOICs on a printed circuit board.

Each of these parts is available in 28-pin SPDIP, SOIC, SSOP, UQFN and QFN packages.

Both devices are available in 28-pin SPDIP, SOIC, SSOP, UQFN and QFN packages.

We decided earlier that we would be using a PIC16F876, so choose Settings -> Microcontroller -> Microchip PIC16F876 28-PDIP or 28-SOIC.

Small SOIC-8 package integrates isolation and power capacitors for low-power applications

Small Outline Integrated Circuit (SOIC) – An integrated circuit with two parallel rows of pins in surface mount package.

Small Outline Integrated Circuit (SOIC): An integrated circuit with two parallel rows of pins in surface mount package.

Small Outline Integrated Circuit (SOIC): An integrated circuit with two rows of parallel pins in a surface mount format.

The dsPIC33FJ06GS001 and dsPIC33FJ06GS101A are offered in 18-pin SPDIP and SOIC, as well as 20-Pin SSOP packages.

The MAX22701E is available in an 8-pin narrow SOIC package (3.90mm x 4.90mm) and operates over the -40 ° C to + 125 ° C extended temperature range.