The package substrate may be configured as a bumpless build up layer (BBUL) substrate.

A bumpless build-up layer (BBUL) integrated circuit package and method of manufacturing are presented.

The spike may be used with or without a metal boss or fishplate to secure a metal rail to a wooden tie.

The spike (1) may be used with or without a metal boss or fishplate (12) to secure a metal rail to a wooden tie (9).

A structure includes a hybrid substrate for supporting a semiconductive device that includes a bumpless build-up layer in which the semiconductive device is embedded and a laminated-core structure.

The microelectronic package further includes a bumpless build-up layer structure formed proximate the encapsulated structure active surface.

In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented.

An example includes a first cam lobe and a first cam lobe lock coupled to the first cam lobe.

The second electrical connector (14) having one of a boss opening (32).

The package substrate may be configured as a bumpless build up layer (BBUL) substrate.

The rocker arm is herein instantaneously actuated by the second lobe portion via the first follower member and, at the same time, by the first lobe portion via the second follower member, once the latter is activated.

The second boss (50) defines an opening (56) for pivotal receipt of the first boss (44) .

The outer boss (26) may have a concentrically continuous surface with or without seals (34, 36) located in grooves (32).

The present invention relates to packaging integrated circuits, more particularly to the structure and processing of a stud (17) and bump without the standard under bump metallurgy.

A structure of a folding pedal linkage comprises a rotating disc on a bicycle body, a boss is disposed on the rotating disc, and a shaft sleeve is disposed on the boss.