The roughening bumps formed in the roughening bump plating have a columnar shape with an interval of not less than 0.1 μm but not more than 1.0 μm between adjacent roughening bumps.
Furthermore provided is a method of roughening the foil.
The first main surface (1a) undergoes the roughening treatment.
The present invention is directed to a polymer film comprising a roughening material.
A non-ordered roughening is applied at a relatively large scale, and another roughening, either ordered or non-ordered, is applied at a relatively small scale.
The roughening is carried out to achieve a surface roughness adjusted to the thickness of the hardcoating.
An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 μm.
In one aspect, a method for roughening a multi-crystalline silicon surface is provided.
An improved substrate for Raman spectroscopy of an analyte comprises a porous metal film Enhancement factors and uniformity of substrate can be enhanced by electrochemical roughening of the film.
The advantage of this method is the elimination of the surface roughening process and the elimination of the preplating process.
The electrochemical roughening method can be used on aluminum alloys in general, including but not limited to 6061 and LP.
A method for roughening a surface of an ion exchange system structure using laser interaction with a surface.
The small scale roughening improves light extraction efficiency by scattering the light that strikes the smaller features.
The surface-treated copper foil exhibits a satisfactory adhesion strength without a conventional roughening treatment.
In the roughening step, the etching rate of the surface layer is larger than the etching rate of the barrier layer.
Each shoulder forming section has a shoulder roughening arrangement to result in molded, roughened shoulders of the block.
Additionally, the selective roughening of the surface may be used to achieve a desired light emission output pattern.
A multilayer printed wiring board needing no roughening processing of the inner layer circuit such as a blackening processing.
A cured body (1) is obtained by roughening a reaction product produced by reacting the resin composition.
Disclosed is a semi-cured body having a reduced surface roughness in a surface having been subjected to a roughening process.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Traduction Translation Traducción Übersetzung Tradução Traduzione Traducere Vertaling Tłumaczenie Mετάφραση Oversættelse Översättning Käännös Aistriúchán Traduzzjoni Prevajanje Vertimas Tõlge Preklad Fordítás Tulkojumi Превод Překlad Prijevod 翻訳 번역 翻译 Перевод