The present invention relates to novel latent hardeners for hardening hardenable polymer resins, particularly epoxide resins, and epoxide resin compositions and to use thereof for producing composite fibre materials.
The present invention relates to novel liquid hardeners for hardening hardenable polymer resins, particularly epoxide resins, and epoxide resin compositions and to the use thereof for producing composite fibre materials.
The invention relates to reactive hardeners for hardenable epoxide resins and to a method for producing the same.
Polyacitals, other polyethers and epoxide resins, in primary forms, polycarbonates, alkyd resins, polyalyesters and other polyesters, in primary forms
Polyacetals, other polyethers and epoxide resins, in primary forms, polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms.
The foam of the present invention is based on epoxy resins.
The invention relates to novel epoxy resins, and epoxy resin compositions or cured articles, produced by using the resins.
Disclosed is an epoxy resin composition for semiconductor encapsulation, which contains an epoxy resin (A) including specific three kinds of epoxy resins (a1)-(a3).
The curable resins can be cyanate ester resins, epoxy resins, maleimide resins, or acrylate or methacrylate resins.
The invention relates to hardenable epoxy resins that are self-dispersing in water and to a corresponding production method.
The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).
A method for preparing a curing agent composition for epoxy resins is described.
Novel mesogens, epoxy resins and the synthesis thereof as well as coating binders for coating compositions based upon the mesogens and epoxy resins are described.
A novel water compatible curing agent for epoxy resins is provided.
Provided herein are polyamine precursors useful in the manufacture of epoxy resins.
Also disclosed is an epoxy resin mixture produced by epoxidizing the phenolic resin mixture.
Process for the preparation of these advanced epoxy cationic resins is also disclosed.
The advanced epoxy resins prepared by the process of this invention are suitable for use in preparing electrical laminates.
The present invention provides a process for eliminating contaminants from epihalohydrin-derived epoxy resins.
The invention also relates to aqueous dispersions containing said special epoxy resins.
These compositions additionally contain ordinary rubber-modified epoxy resins and liquid and/or solid polyepoxy resins and ordinary hardeners and accelerators and, optionally, fillers and rheology auxiliary agents.
Previous epoxy resin compositions having in situ prepared addition polymers result in heterogeneous mixtures which are substantially free of epoxy groups.
The invention further relates to the use of said special epoxy resins for coating solid substrates
Blends of this epoxidation product, cured epoxies from the product or the blend, and methods for making the epoxidation product, blends and cured epoxies are also disclosed and claimed.
Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins.
The composition can further contain (G) a hardener for epoxy resins.
Said epoxy resins are special α,β-unsaturated carboxylic acid ester-based compounds.
Said epoxy resins are special α,β-unsaturated carboxylic acid ester-based compounds.
The invention also relates to multi-component systems for producing epoxy resin compositions, cured epoxy resins, a powder component K3 for the multi-component system,to uses and methods.
Many properties of epoxies can be modified (for example silver-filled epoxies with good electrical conductivity are available, although epoxies are typically electrically insulating).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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