The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.

A wiring board for mounting an LED bare chip capable of firmly joining an LED bare chip and improving yield.

A chip with double layers of pins includes a bare die (1), a filling body (2) and pins (3).

It is difficult to dissipate heat generated from a bare chip.

In a substrate (11), there is formed a recess (12), in which a bare chip (30) of a light emitting diode is mounted, and the bare chip (30) and the conducting portions (32) of the substrate (11) are connected by conductors (33).

A bare chip mounted board on which electronic parts can be mounted at a high density.

Disclosed are a structure and method for mounting a bare chip or a chip size package with high connection reliability.

Burn-in testing of the bare die has the benefit of saving packaging efforts.

To one of the two placement surfaces is connected an N side region (71)(cathode side) of a bare chip diode (70), and to the other placement surface is connected a P side region (72)(anode side) of a bare chip diode (70).

In flip-chip mounting, the IC chip is not packaged but is mounted directly onto the PCB as a bare chip.

The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface.

For multiple die packages, burn-in testing of the bare die has the benefit that each individual die can be burn-in tested separately from the package.

To 1971, the industry and introduced with the same efficiency GaP green bare chip LED.

At least one bare die electronic element is provided having a top conductive side and a bottom conductive side.

At least one bare die electronic element is provided having a top conductive side and a bottom conductive side.