The conductive-material powder is mixed with the binder ingredient in such a ratio that the proportion of the powder is 50-80 mass% based on the sum of the powder and the binder ingredient.

The powder compositions according to the invention comprise an aluminium-based powder and a binding agent.

The oxidant may be in the powder, and the reductant in the binder; or the reductant may be in the powder, and the oxidant in the binder.

The conductive-material powder is mixed with the binder ingredient in such a ratio that the proportion of the powder is 50-80 mass% based on the sum of the powder and the binder ingredient.

The preferred powder heavy metal is tungsten, and the preferred powder metal binder is copper.

The microporous layer is formed from a polymer binder, a polymer powder, a surfactant and a mineral powder.

The mixture includes a cutting table powder and a binder.

The method involves compounding the components of powder materials, binder, solvent for the binder, surfactant, and non-solvent with respect to at least the binder, the solvent, and the powder materials.

The enveloping layer is formed by a second powder and a binder.

Vegetable fiber powder is mixed with vegetable binder powder consisting of a mixture of starch powder and gum powder.

The coating compositions comprise copper powder, golden powder, additives and binding.

The powdered metal binder can be a combination of copper powder, lead, and molybdenum.

The binder is powdered ethyl vinyl acetate.

The binding agent is blended with the metal-based and alloying powders at elevated temperatures preferably below the melting point of the binding agent.

The coating powder comprises inorganic material and polymeric binder material.