The polishing pad (29) includes a work surface engageable with a front surface of a wafer for polishing the front surface of the wafer.

The step (b) comprises polishing the surface opposite of the main surface of the formed substrate (101).

The composition is applied to a plastic surface and used to polish the surface.

An article and method are provided for polishing a substrate surface.

The composition can be used to polish the surface of a tungsten containing substrate.

The invention relates to a forming device for smoothing the surface of a workpiece.

Further force acts to allow the pad outer section to expand and move the cleaning element out of engagement with the work surface, allowing the rotating foam outer section to be used to polish the cleaned area of the work.

This polishing composition is used to polish the surface of a compound semiconductor substrate.

The composition for polishing purposes can be used mainly for polishing the surface of a silicon substrate.

However, it needs to comply with the external surface of the sample.

The invention also concerns a method for polishing the surface of a material using said abrasive aqueous suspension.

Similarly, grinding machines were designed to simplify and speed up the work process, if necessary, to polish or polish a certain surface.

Grinders are made to facilitate and speed up the process of work, if necessary, to polish or polish the surface.

Surfacing: An operation consisting of polishing the surface of a raw part.

The method includes applying the above composition to the copper or aluminum surface and polishing the surface in the presence of the composition.