A method and apparatus is disclosed for polishing the face of a semiconductor wafer.

The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer.

The method for burnishing the portion of the wheel face.

Disclosed is a double sided adhesive tape for fixing a polishing pad, which enables to improve the polishing accuracy of the polishing pad.

A method and apparatus is disclosed for polishing the face of a semiconductor wafer.

Disclosed is a process for polishing a special-shaped face of marble.

A polishing wheel (10) arranged to polish an article.

The polishing pad is formed of a polyurethane foam having a groove in the polishing face.

The pressure plate (40) is constructed for simultaneously holding multiple wafers (w) with a polish face of the wafers facing polishing surface (46) of turntable (14).

An apparatus (11) for heating a polishing block (13) priorto wax mounting an article to be polished on the polishing block(13) comprises a heater (19) for heating the block and a chuck(15) including a surface (17) for supporting the polishing block(13).

machine for polishing silk yarn in hanks

machine for polishing silk yarn in hanks

The polish head is coupled by shaft (22) to head motor (24) driving the polish head.

The present invention relates to a polishing agent for polishing a surface to be polished of an object to be polished.

The polishing pad of the present invention is provided with polishing powder firmly bonded onto one side of the base formed into a wide area to improve the durability of the polishing pad.