Think of a side view of a production line, a floor plan of a floor or production hall, or a plot plan of a terrain.

The back of a main ground bonding pad of a main chip is a whole ground plane.

A second conductor plane contacts the second of the at least two part segments and a second contact pad.

A third conductor plane joins both part segments together and contacts the third contact pad.

A split-plot experiment in CRD with 4 replications was used.

A replicated four-level split-plot experimental design was used.

The p-type electrode (17) is composed of a pad portion (P) and a linear portion (L) that extends linearly from the pad portion (P) and has a circular shape when viewed in plan.

One first conductor plane contacts the first of the at least two part segments and the first contact pad.

In the planar view, the supporting member (14) is provided at a position that overlaps the pad electrode (12).

The bonding pad has a bonding pad surface and a bonding pad edge.

A non-contact power supply pad is provided with a power-receiving side pad (111), a power-transmitting side pad (110), and an auxiliary pad (112).

First interface circuit is electrically coupled to the first pad and the third pad, while second interface circuit is electrically coupled to the second pad and the fourth pad.

A second auxiliary test pad (60) is adjacent to the primary bonding pad (58).

The plane in the Pentagon frame was too small to be a Boeing 757

The solder ball pad also has an anchor pad (201) coupled to the bonding pad and extending between the substrate and the solder mask.