Provided are a method of preparing a hematite platelet, a hematite platelet prepared using the method, and a hematite platelet pigment including the hematite platelet.

For this reason, flow cytometry has been found to be a sensitive method for platelet counting, as well as for the detection of platelet-associated immunoglobulin G (PAIgm), which is a marker for children with ITP.

This technique is painless and has no allergy risk since the obtained PRP (Platelet-Rich Plasma) comes from the patient itself.

Forming each modified platelet does not include modifying the platelet membrane of each platelet with a glycan-modifying agent.

Each modified platelet includes a platelet and at least one polymerated chemical.

Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer.

The invention provides for the capping wafer (14) to be embodied by a glass wafer (24).

The inlet plate (6) is attached in the cartridge housing (3) while the control plate (5) is capable of sliding movement and rotation on the inlet plate (6).

The invention relates to a semiconductor chip wherein a strip conductor structure is linked with a dielectric that is capable of producing, by the introduction of ions, a conductivity that is sufficient to interconnect the conductors to give a circuit.

The system includes a wafer head disposied above a wafer, where the wafer (402) head includes a first active retaining ring (404) capable of extension and retraction.

additional indicator maintaining small plate

sliding pinion maintaining small plate

hour wheel maintaining small plate

winding stem maintaining small plate

handsetting pinion maintaining small plate

Back plate and shoes.

The coupler board is between and perpendicular to the platform board attached to the housing and the splitter board attached to the lid.

In a CATV housing the main RF circuit, a coupler circuit and splitter circuit are located respectively on a platform board, coupler board and splitter board respectively.

This technique could extend control across an entire chip or wafer.

Either chocolate chips or chopped chocolate will work for this method.

Any type of solid chocolate bar or chocolate chips will work using this technique.

A stacked electronic component (100) comprises a substrate board (104) and a first semiconductor chip (101) mounted by a flip chip technique to the substrate board (104).

An inkjet printhead chip includes a wafer substrate (116).

A technique for reducing backside particles is disclosed.

With this method, adhesion of particles to the surface of a semiconductor wafer such as a silicon wafer can be reduced and local etching of a wafer can be prevented.

A simple application pad (3) contacts a conjugate pad (4) containing microparticles coated with anti-glycated albumin antibody.

In another embodiment, the pad has three vias directly coupled to the pad and formed substantially beneath the pad.

A paddle member includes a handle member connected between the paddle member and the semiconductor die to suspend to paddle member in the hole.

A micromachine device is provided with a pad (107a) and a pad (107b) composed of impurity doped polysilicon.

A polymer pad is disposed on each metallic pad wherein a ratio of an exposed portion of an upper surface of the metallic pad to a top surface of the polymer pad is at least about 3.5 to 1.

The spring is configured to bias the upper pad and the lower pad towards each other.

The paddle lead assembly further includes a plurality of lead bodies coupled to the paddle body.

A surface mount component placement arrangement includes a circuit supporting substrate (202) having a first surface (308), and disposed thereon are a first pad array (502) and a first at least one aligning pad (506).

A bore (44) is formed in the proximal end of each suction pad (16, 17) and extends toward the distal end of the suction pad.

The electrical connector includes an upper pad, a lower pad, a fastener, and a spring.

Lining or pad contaminated (oil, grease etc.).