Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed.
The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
The underside of the metal housing can be soldered to the circuit board resulting in a great mechanical and electrical connection to the circuit board.
Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed.
The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
On the board unit (BU) of the plug-in unit, a connector bar (32, 322) is soldered, which contains counter connectors for the connectors of the auxiliary circuit board.
The reactive solder material of the invention may be soldered to semiconductor surfaces such as the backside of a die or wafer.
On its lower end the connector body (1) has at least one projecting zone with which it can be inserted in a printed board and soldered to the opposite side thereof.
The mounting foot (70) is soldered to a metalized mounting pad (90) on the circuit board (14).
The second lead (12) forms an upper connexion, the head part (12a) of which is welded to the plate (10).
Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.
From each connector extends a wire path on the circuit board to a connector bar, which is soldered to the circuit board edge and from which connector pins (313) protrude outwards.
In particular the terminal (7) can thereby be soldered to a solder eye on the other side (9) of the circuit board (2) as a solder connection.
The circuit board (17) is also soldered to connector elements (16) on a connector strip (15) mounted on the front of the switching device (10).
The connecting track is formed by a separately manufactured conductive connection section (6) subsequently applied to the printed circuit board (1) and is soldered to the layers (2).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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