amount of deviation from the intended cut path

amount of concavity or taper cut

amount of deviation from the intended cut path

The cutting apparatus (10), despite its simple apparatus structure, can perform cutting without producing cuttings, with small dimensional variations, and with high cut-plane flatness.

Polishing conditions in the polishing step are changed on the basis of the planarity of the surface, said planarity having been measured in the planarity measuring step.

As a result, in order to evaluate the flatness, the profile determination of the metallic strip (1) is used, additional flatness measuring devices such as flatness measuring rollers are no longer required.

To this end, a measurement of flatness is carried out on the moving metal strip, and the measurement results of this measurement of flatness are drawn upon for specifically influencing the flatness of the metal strip.

The external surface of the synthetic sheets (1, 2) thus remains protected between these two operations and the cards have better inherent flatness.

of a flatness measurement: I-unit ± 4

of a flatness measurement: I-unit ±4

The lower electrode and the flat organic layer serve as a cathode.

The curable resin composition enables to form a cured film having high flatness even on a base having low surface flatness.

By enhancing the flatness of the polarizer, the resolution can be improved.

deviation from flatness of a measuring face

A graphite film exhibiting excellent flatness can be obtained by means of said flatness correction treatment.