A transfer molded high lead count plastic semiconductor package is described.
An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing (12) with metallic lamination layers is provided.
Transfer moulded semiconductor power module comprising
Transfer moulded semiconductor power module comprising
The white LED device having the dual molds can be a lamp-type LED device, an injection-molded housing package-type LED device, or a transfer-molded chip-type LED device.
The polyurethane can be liquid-cast, transfer-molded, sprayed, and extrudable without changing either the chemistry or stoichiometry of the polyurethane.
Specifically, a diode chip (6) is arranged within a diode module (2).
The diode module (2) is made by transfer molding, and fitted in an opening (22) in a module box (20).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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