In certain environmental conditions, a DC differential can cause etching and electrochemical migration.
Provided is a highly heat-conductive printed wiring board, which is capable of eliminating generation of electrochemical migration by suppressing elution of copper ions.
Electrochemical migration is most common with tin and silver, but even copper will occasionally produce those little filaments of destruction.
While neither is desirable, electrochemical migration is the greater risk to performance and lifetime in high voltage designs.
Adhesives — Test methods for isotropically electrically conducting adhesives — Part 8: Electrochemical-migration test methods
Adhesives — Test methods for isotropically electrically conducting adhesives — Part 8: Electrochemical-migration test methods
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k, -2000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k, -2000k,
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