A slidable wafer is carried on the wafer housing.

The cutting insert (100) is seated in an insert pocket (206) with the insert protrusion abutment surface (134) in abutment with the pocket base.

In the base (45) of the plate seat (39) there is an opening, through which the adjusting part (69) protrudes into the plate seat (39).

A cutting tool (12) with a cutting insert (16) secured in an insert pocket (14).

Inserted into this seat is a cutter plate (1) having at least one minor cutting edge.

During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.

The outer surface (36) of one engagement protrusion (32) engages a major wall (38) of the insert pocket (14).

The present disclosure provides for a lock cylinder having a rotatable spindle with at least one disc and at least one wafer housing rotatingly engaged therewith.