An ultrasonic bonding machine is provided.
The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.
The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation.
The invention concerns a method for mounting a piezoelectric resonator (40) inside a case (80) by ultrasonic bonding of the piezoelectric resonator to a base part of the case.
Disclosed is an ultrasonic bonding tool that can bond a lead wire even to a surface of a thin-film base such as a glass substrate having a thickness of not more than 2 mm without any problem.
In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
An ultrasonic bond is formed using a bond tool foot (700) having a waffle shape of thin protrusions (708) and gaps (712) between the protrusions.
An ultrasonic joining device (100) is provided, although not shown, with a control unit for controlling the temperature of heating of the rotating drum (110) by the temperature adjustment mechanisms (260).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Traduction Translation Traducción Übersetzung Tradução Traduzione Traducere Vertaling Tłumaczenie Mετάφραση Oversættelse Översättning Käännös Aistriúchán Traduzzjoni Prevajanje Vertimas Tõlge Preklad Fordítás Tulkojumi Превод Překlad Prijevod 翻訳 번역 翻译 Перевод