The link may be a direct wired link (19) a wired link (19) in series with a wireless link (23) over a telephone network (24).

A method of forming a wire bond using a bonding tool supported by a transducer of a wire bonding machine is provided.

The device may be connected via a wire or wireless connection to the telephone.

A gateway is coupled, via a wireline link, to a VLC access point.

After the separation, the chip (1) is connected to a lead section by performing wire bonding using a new gold bonding wire.

This invention concerns a process for producing a bonded wire connection between two contact surfaces (2) wherein the connecting wire (5) in each case is connected by means of two auxiliary connections (41, 42) applied to the contact surfaces (2).

Such a configuration also lowers costs relative to similar semiconductor packages that use wirebonded connections.

A wire bonder comprises a bonding head (1) with a rocker (8) which is arranged on the bonding head (1) and is rotatable about a horizontal axis.

A hard-wired copper wire is less likely to have a transmission problem.

Identify each wire connection and note the location of each on the starter.