The method includes the use of an elastic dielectric seal to form a high vacuum seal.

The dielectric joint (4) includes a flange portion from respective housing sections.

The feed consists of a waveguide tube, a dielectric joint and a sub-reflector.

Embodiments of the present invention are directed to fuel cell enclosures separate by a dielectric joint.

Before further actions, install a dielectric gasket after the tap to break the electrical network.

The method includes the use of an elastic dielectric seal to form a high vacuum seal.

The dielectric material constituting a joint portion (22) is a BaO-TiO2-ZnO dielectric material.

The dielectric joint (4) includes a flange portion from respective housing sections.

The feed consists of a waveguide tube, a dielectric joint and a sub-reflector.

The chip is encapsulated by means of a seal or dielectric layer.

These processing methods facilitate the peeling off of a metal seal and thus prevent dielectric heating.

The topcoat dielectric layer can have a dielectric constant greater than the dielectric constant of the undercoat dielectric layer.

The dielectric layer forms a dielectric window therethrough.

As with the semiconductor ink, the field dielectric wall confines the flow of the dielectric ink.

The dielectric structure contains a dielectric material.