The interconnect system includes a local interconnect and a global interconnect.

The first interconnect and the second interconnect are disconnected on the interconnect level.

The electrical interconnect can include one or more of a data voltage interconnect, a scan-line interconnect or a global interconnect.

The third interconnect and the fourth interconnect are disconnected on the interconnect level.

In a particular embodiment, a system is disclosed that includes a first interconnect and a second interconnect coupled to the first interconnect.

A TSV die is provided (101) including TSVs that extend from a front side of the TSV die to TSV tips on a bottom side of the TSV die.

An electrical interconnect assembly and methods for making an electrical interconnect assembly.

An interconnect assembly is disclosed herein.

A width of the second electrical interconnect is greater than a width of the first electrical interconnect.

The plurality of feedthrough interconnects include a first feedthrough interconnect and a second feedthrough interconnect.

A ULSI micro-interconnect member comprises a substrate and a ULSI micro-interconnect formed on the substrate.

A flexible magnetic interconnect is disclosed.

development and inter-connection of trans-European networks

A metal interconnect comprising cobalt and method of forming a metal interconnect comprising cobalt are described.

A set of interconnects on at least one additional interconnect level couple the first interconnect and the second interconnect together.