The purge gas supply system (100) includes a purge gas mixture generator (120) configured to generate a purge gas mixture which includes at least one purging gas and moisture.
The purge gas supply system (100) includes a purge gas mixture generator (120) configured to generate a purge gas mixture which includes at least one purging gas and moisture.
A purging chamber purges the surface of the web substrate with a purge gas.
The purge gas in the purge zone is used to remove hydrocarbon fluids from the polymer solids, and a stream containing the purge gas and hydrocarbons is passed to a hydrocarbon/purge gas recovery zone.
The purge gas supply is configured to supply a purge gas through the at least one fluid port.
Argon gas is used as a purging gas in the pump unit (2).
The reaction chamber (4) is arranged such that a purge gas stream (200) flows from the purge gas inlet (106) to the discharge channel (100).
Thus, a purge gas is allowed to flow in gas purged immersion heater housing.
The apparatus also has a purge gas supply system (100) configured to provide a purge gas near a surface of a component of the lithographie projection apparatus.
The central purge gas inlet is for providing a purge gas.
The apparatus also has a purge gas supply system (100) configured to provide a purge gas near a surface of a component of the lithographic projection apparatus.
Purge gas is blown out from a purge nozzle (70) provided to the side of the electrodes (21).
In the present invention the purge gas channel (12) is at least partly open to the gas atmosphere (14) comprising purge gas for subjecting the surface (4) of the substrate (6) to purge gas.
A gas separator receives the pumped gases exhausted by the pump, and recovers the first gas and the purge gas from the stream.
A sleeve may direct the discharge purge gas in the interior.
Purge gas may be exhausted or recirculated.
The gas manifold is in fluid communication with at least a second reactive gas different from the first reactive gas and a purge gas.
Purge gas is also directed to the slit valve.
Preferably, the purge gas has a relatively high thermal conductivity.
The argon recovered by the noble gas processing unit (30) is used as the purging gas of the pump unit (2).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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