Apparatus for measuring surface coarseness of a surface of a workpiece such as an ultra-high precision work surface by optical scanning.

The trajectory (K) is projected onto the surface (O) that is to be machined.

A mandrel assembly (10) for use in a portable lathe apparatus for machining the end face of a hollow workpiece (12).

A first surface (12) of a workpiece (11) is machined by means of fixed rollers.

The sleeve is inserted into an aperture in a workpiece with the expandable portion protruding beyond the blind face (46) of the workpiece and the head abutting the near face (45) of the workpiece.

The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer.

The workpiece feeding device includes a pusher head which contracts the workpiece.

Additionally, a second surface (13) of the workpiece (11), which is located across from the first surface (12), is machined by means of fixed rollers such that even thin-walled workpieces can for the first time be machined by means of fixed rollers.

The invention relates to a device and a method for machining the rear side of semiconductor chips.

An end face clamping tool for a workpiece, in particular, an end face clamping tool for a box type workpiece comprises a bottom plate (2) and an upper template (1).

Thus, the construction is formed rigidly to thereby hone the workpiece, and to thereby both bore and hone the workpiece.

A magnetic lifter device having a housing with a work piece engagement face.

A laser machining system (10) for machining a workpiece (15) is disclosed.

The table (2) also comprises a second face (22) for holding steady a second part (221) to be machined.

The thickness of the top face of the outer blade of the electric shaver is consistent, so the outer blade is easy to be processed.