The process is solvent free, smooth, and robust.
The process is solvent free and the gaseous acid is mixed with one or more inert gases.
An organic solvent free, especially formaldehyde free molding obtained essentially from vegetable wastes and a thermoplastic resin only at low cost; and a process for producing the same.
Acyl lactam is made by reacting an acyl halide with a lactam in a substantially non-aqueous, substantially solvent free, reaction mixture containing an inorganic base.
The process can be organic solvent-free.
The substantially solvent-free product obtained by the distillation of the solvent from filtered coal extract solution produced by digesting coal in a liquid solvent.
The system has little or no organic solvent, and the organic phase contains an electrophile which participates in the reaction.
The present invention relates to a new solvent-free process the preparation conjugated linoleic acid (CLA).
The application of the solvent-free polyurethane in preparation of glove.
Additional steps can include; (d) adding a curing agent to the solvent-free mixture; and (e) curing the solvent- free mixture, forming a CNT-polymer composite, wherein the CNTs are dispersed and integrated into the polymer mixture.
Polymers derived from various monomers are purified by fractionalization of the crude polymers in a solvent/non solvent system via reverse precipitation.
A process for producing a paroxetine salt containing no organic solvents by substantially and safely removing the organic solvent contained in paroxetine hydrochloride.
The UV curable coating is substantially free of solvent, therefore, contains nearly 100 % solids.
The solvent-free adhesive combines a reactive styrene-acrylic latex emulsion and an ethylene-vinylacetate copolymer.
The method can be used for efficiently producing nondeliquescent, crystalline calcium pantothenate which is substantially free of an organic solvent.
At least one of the first surfaces is provided with coating which is most preferably a solvent-free polymerization coating.
The filler contains at least one high-melting-point conductive compound and the proportion of filler is 20 to 50 vol % in relation to the solvent-free polymer-filler mixture.
To provide a polymer product, which is substantially free from an organic solvent and a metal atom, and has a number average molecular weight of 12,000 or greater.
The face material is of polyolefin, and the adhesive layer comprises a solvent-free radition curable hot melt adhesive.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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