The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly.

The integrated electronic device can include an electronic assembly, such as an active RFID assembly, that is electrically coupled to a thin printed flexible electrochemical cell.

According to the invention is also defined a method for producing an electronic assembly with stackable modules comprising of component carriers with connection pins, and such an electronic assembly.

The electronics sub-assembly and the windings are contained in a housing from which the electronics sub-assembly may be removed for repair or replacement.

Methods are provided for forming an electronic assembly (54).

The two members are coupled together and totally surround the electronic assembly.

A remote sensor unit may comprise an electronic assembly.

An electronics module comprises an electronics assembly having a first connector and a second connector.

An electronic time delay assembly, a trigger assembly and an initiator are also disposed within the housing assembly.

Methods and apparatuses for an elecronic assembly.

A ground line electrically couples the electronic subassembly to the housing.

A multilayer electronics assembly and associated method of manufacture are provided.

An assembly for retaining a coil wire assembly in the pocket of an electronic assembly such as, for example, a sensor.

Methods and apparatuses for an electronic assembly.

An electronics assembly (292) is adapted to fit within the cavity.