dissipation of heat of hydration
In addition, various internal and external heat sink structures are provided which facilitate dissipation of heat in a multichip package or in a stack of multichip packages.
The ribs also facilitate the dissipation of heat due to friction and ambient sources of heat.
The component (20) may include a heat sink to enhance dissipation of heat from the encapsulated integrated circuit device (10).
The accumulated dust just obstructs the dissipation of heat.
Especially, the second radiation heat dissipation film on at least one of the heat dissipation holes can improve the heat dissipation efficiency of the heat dissipation structure.
A system and method for heat dissipation are disclosed.
Furthermore, the porous heat dissipation fin (40) is adhered to the first radiation heat dissipation film (30).
Thus, improved is the heat dissipation of the semiconductor device (10) to which the heat dissipating member (80) is attached.
The ceramic radiation heat dissipation structure includes a ceramic substrate (20), a first radiation heat dissipation film (30) and a porous heat dissipation fin (40).
The heat dissipating apparatus includes a main body and a plurality of heat dissipating fins.
The heat conducting/dissipating module comprises a substantially columnar heat conducting device and at least a heat-dissipating fin.
The device includes the heat removal structure configured to dissipate the transported heat.
The package provides an efficient means for dissipating heat.
The heat capacity of the heat dissipating body (5) can be changed as needed by changing the shape of the heat dissipating body main body (15).
The heat dissipating module dissipates the heat which has been received by means of the heat receiving body.
The fluid pump operates to pumps fluid through a closed fluidic system between the heat exchanger and a spot where the heat can be dissipated.
A small unitary package design is achieved by reducing the level of power dissipation, and subsquently, the size of the heat sink required for heat dissipation.
The air conditioning system is also provided with a heat dissipation suppressing structure (60) for suppressing the heat dissipation from the equipment (53, 54, 55) to the surrounding environment.
The ceramic material can be used for heat dissipation.
A nanocoating for dissipating heat, the coating having a thin film coating affixed to a surface in need of heat dissipation.
The aim of the invention is to improve heat dissipation in such a piston.
The heat dissipating pieces (111) provided on the heat dissipating unit extend laterally or towards the ground.
Thereby, it can obtain good heat dispersing effect.
Additional features include impact resistance and heat dissipation.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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