The heat-dissipating device comprises a dissipator, a second base, and a second heat-conducting pipe between the dissipator and the second base.
solid roller bucket dissipator
The heat dissipator heats the air to be dehumidified and the moisture discharging section humidifies the air heated by the heat dissipator.
The electrostatic dissipator includes a 'hardening' circuit, such as a voltage-overload circuit, which serves to protect the components of the electrostatic dissipator itself.
Similarly, the electrostatic dissipator improves the efficiency of a conductive electrostatic solution.
The ∏-shaped heat pieces (1) comprise heat sink crossbars (2) and heat sink fins (3).
The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration.
Provided is a heat sink in which the cooling efficiency of the heat sink is improved without increasing the size of the heat sink.
The heat sink body (1) comprises heat sink pieces (7) and a center hole, and the heat sink pieces (7) are uniformly arranged around the center of the heat sink body (1).
A heat sink, which is multiple heat sink pieces (1) stacked together.
A heatsink and a heatsink device using the heatsink are provided.
The heatsink device includes a plurality of heatsink fins that extend from a heatsink base.
The light assembly (10) includes a first heatsink (50) and a second heatsink (60).
The present disclosure is related to a heatsink and a method for forming a heatsink.
The IGBT and the diode are fixed to the heat spreader, and are electrically connected with the heat spreader.
A heat sink (2) and a backlight module using the heat sink (2).
The light source heat sink and the driver heat sink are separated by an air gap 114 to provide thermal decoupling of the light source heat sink and the driver heat sink.
The second heat sink is thermally connected to the first heat sink via an aperture in the housing.
A heat sink is provided.
The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader.
A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure.
The apparatus (100) includes a heat sink (114), wherein the heat sink (114) comprises a plurality of fins (116) extending from the heat sink (114), and wherein the heat sink (114) is configured to engage the device (102).
Provided are a heat spreader for a semiconductor device and a method for manufacturing the heat spreader.
A convective heatsink and a method of forming a convective heatsink.
A heat sink structure is included with the pedestal thermally coupled to the heat sink structure.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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