The system heat is then removed from the outer surfaces of the housing (20) using conventional heat transfer mechanisms (22).

For example, look at the heat diffusion equation .

By diffusing heat through the thickness increased part, the heat generated by the semiconductor element can be directly dissipated, thereby improving the heat dissipation performance of the semiconductor device.

That extra space is important for the diffusion of heat.

The principal difference lies in the way in which the heat is made.

In the heat release extension, diffusion of heat conducted and transferred from a terminal strip corresponding thereto into ambient air is activated.

The situation is very similar to that of heat propagation.

The heat transfer area may also not be constant as well.

These provide increased flexibility in the control of room heating.

The difference between the two systems lies in the mode of diffusion of heat.

The openings use for the ventilation and dispersion of heat must never

The basic difference is in the heating of the building.

Cooking then continues as the heat is distributed within the food.

This type of heating doesn’t use air as the vector for heat transfer.

This type of heating doesn’t use air as the vector for heat transfer.