The composition comprises wax and a dewetting agent.
The dewetting agent is preferably an ethoxylated acetylenic diol.
In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetting metal pad (52).
The soldering nozzle (61, 81) of the present invention achieves an improved dewetting performance.
Durable, impact-resistant structural coatings with dewetting and anti-icing properties are disclosed.
Opening the lids is associated with a partial de-wetting of the eye (receding angle).
A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102).
The receding angle which occurs on de-wetting is usually smaller than the advancing angle.
The film is softened through a melting or glass transition process and the thermal gradient induces a directional dewetting down the thermal gradient.
A further de-wetting layer (13) is deposited on a connecting side of the sub-mount (2) which is to be connected to the VCSEL chips (1).
The advancing angle is determined during the wetting process and the receding angle during the de-wetting process.
The difference between the contact angle measured during wetting (advancing angle) and de-wetting (receding angle) is referred to as hysteresis.
The invention comprises a process in which to a sewage sludge there is added a fibrous additive, an optional coagulant, a dewetting additive and a flocculant polymer which is followed by mechanical de-watering.
According to an exemplary liquid crystal composition, uniform orientation can be performed without defects such as a so-called dewetting phenomenon and the like, in an orientation process of a horizontally oriented liquid crystal.
The de-wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub-mount (2) and the VCSEL chips (1).
The dynamic contact angle is the contact angle which occurs in the course of wetting (advancing angle) or de-wetting (receding angle) of a solid.
In the locally melted metal layer, de-wetting effects can occur due to surface tensions, meaning that the metal shifts and exposed surface regions (37) are formed on the solar cell substrate (27).
A de-wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub-mount (2).
Because the surface energy of the sidewalls is lower than that on the protrusions, polymer dewetting from the sidewalls is promoted, which makes the polymer film discontinuous along the edges of patterns.
Hysteresis occurs with the dynamic contact angle, as the contact angle usually assumes different values in the course of wetting (advancing angle) from de-wetting (receding angle).
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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