1 brittle and ductile fracture mechanics analysis of surface damage caused during cmp... It 2 gives an explanation for chatter marks, surface flaking in interlayer dielectric material (ILD) and rolling indenter and plastic plow lines in copper on the wafer surface during CMP of silicon chips....
Comparison of carnivore-induced tooth scores (left column) and air-scribe-induced grooves (right column) under sem.... C) Shallow tooth score with chatter marks, a smooth left margin, and an irregular right margin on a bovid long bone; scale bar = 1.0...
Proof copy [jes-06-1527r] 042703jes brittle and ductile fracture mechanics analysis of surface damage caused during cmp... It gives an explanation for chatter marks, surface flaking in interlayer dielectric material, and rolling indenter and plastic plow lines in copper on the wafer surface during CMP of silicon chips
Mechanism of the strip surface chatter marks with 1220 cold rolling mill... It was found that had reaction to the mill that caused the forced vibration mill to further accelerate the formation of chatter marks....
