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électronique et électrotechnique - iate.europa.eu
Fabrication and characterization of embedded active and passive device for wireless application... The embedded chip and passives were electrically interconnected by small laser via(30??m) and Cu pattern plating process after atmospheric pressure plasma treatment, which revealed an effect on filling of micro via and shape of fine pattern....
général - core.ac.uk - PDF: repository.hanyang.ac.kr

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