Bases of the posts adjacent to the intermetallic layer can be aligned with the intermetallic layer.

An intermetallic layer is formed between the first plate and the dielectric layer.

At that stage, a second intermetallic layer (7) is formed between the solder material (6) and the first intermetallic layer (3) realizing electrical contact.

In addition, formation of a compliant substrate includes utilizing an intermetallic layer (362) of an intermetallic compound material.

The nickel layer and the substantially continuous intermetallic layer make up the layered barrier structure of the interconnection.

Also, a similar intermetallic layer may be placed above the ferroelectric cell.

The intermetallic layer is either deposited directly over the silicon substrate (40) or over an intermediate TiN layer (42).

A preferred composition of the intermetallic layer is a refractory silicide, especially a refractory disilicide.

A copper/zinc intermetallic layer is formed during the flow and solidification of the solder.

The intermetallic layer comprising an alloy of the materials of the first plate and the dielectric layer is thermo compression bonded to the first plate and the dielectric layer.

The corrosion resistant coated base metal (12) includes a heat created intermetallic layer (140) primarily including copper and zinc.

A soft solder material layer (6) on the other substrate (4) is used for contacting the brittle, rough intermetallic layer (3) that will break.

A conventional overlay coating may then be applied to the intermetallic layer without risk to the underlying substrate.

The deposit, when submitted to continual use of the vehicle, forms an intermetallic layer, which each time protects the substrate against corrosion.

In one aspect, a rough and brittle intermetallic layer (3) is formed on the conducting material (2) on a first substrate (1).