The solution includes a triazole or other component for inhibiting the corrosion of copper and brass.

The patina prevents further corrosion of copper beneath the oxidized layer.

The terminal group is hydrophilic to allow binding to the bio-receptor, and inclusion of the carbon-comprising chain, limits or avoids corrosion of the copper.

Generally, polyphosphates increase the corrosion rate of copper (Vik et al., 1996).

When the acids on your sweaty skin (or in your lotion) cause the copper in the jewelry to corrode, the process creates copper salts.

Raising the pH is an effective method for reducing copper corrosion and thus, minimizing copper levels in drinking water.

Copper corrosion in home plumbing systems is a common phenomenon, which can have many causes.

A process tool (200) for electrochemically treating a substrate (201) is configured to reduce the oxygen concentration and/or the sulfur dioxide concentration in the vicinity of the substrate so that corrosion of copper may be reduced.

The water quality factors that have the greatest effect on copper corrosion are pH and alkalinity.

Radiation levels equivalent to 30 mm of copper shielding had no significant effect on the corrosion behaviour of copper.

At higher pH values (above about pH 8), copper corrosion problems are almost always associated with non-uniform or pitting corrosion processes (Edwards et al., 1994a; Ferguson et al., 1996).

The corrosion resistance of copper also makes it especially appropriate for long-term use in marine environments.

Sulphate is a strong corrosion catalyst implicated in the pitting corrosion of copper (Schock, 1990; Edwards et al., 1994b; Ferguson et al., 1996; Berghult et al., 1999).

The removal composition includes a diluent, a solvent and a copper corrosion inhibitor, wherein the diluent may be a dense fluid or a liquid solvent.

Sulphides have been shown to be significant factors in inducing copper corrosion and have been associated with pitting at pH 9.2 (Jacobs and Edwards, 2000).