The heat transfer element includes a second thermal contact surface different the first thermal contact surface and in thermal communication with the first thermal contact surface.

The electrical contact may also provide thermal contact between the device and heat sink.

The fluidized gas thus no longer comes into thermal contact, or only partially so, with ambient air.

The white light source further includes a thermally conductive base in thermal contact with the light-emitting diode and a thermo-electric cooler in thermal contact with the thermally conductive base.

Another pair of such thermal sensitive devices is in thermal contact with the substrate.

The first plate thermally contacts a heat generating member.

The thermal management system may further be in thermal contact with the heat dissipation element.

A heat sink portion (18) is engaged in thermal contact with the contact carrier (13) and the first substrate (16).

At least one thermal adjustment device is in thermal contact with the manifold device.

The system comprises a heat exchanger in thermal contact with the thermal component.

Liquid allows for good thermal contact between the heat sink (22) and the disc (12), reducing the problem of thermal contact resistance found when more solid means of contact are used.

The thermal contact between the heat sink and the electronic components to be cooled is formed by a thermal pad.

The curved channel provides an improved thermal contact between the ribbon and the heat reservoir.

The heat exchanger (21) is in thermal contact with the dead pipe (17).

The upper surfaces of the heat sink crossbars (2) are thermal contact surfaces.