The planar contact plane has a diameter (40).

One contact of the contact pair defines a first mating interface defining a second plane and the other contact in the contact pair defines a second mating interface defining a third plane.

The undulations (38) are in a dimension perpendicular to the planar contact plane.

The contact )20) includes a contact member (24) having a generally planar mating surface (28) with a planar contact plane (32) and a plurality of purposely introduced undulations (36) therein.

The contacts of the semiconductor component are contacted in a planar manner, the insulation film being used for the planar contact.

The undulations (38) have a depth substantially smaller than the diameter of the planar contact plane.

A skin contact plane (Ps) defines a plane ( P1A) tangential to the guard and the skin contact element and a plane (P2A) tangential to the skin contact element and the cap.

The contacts of the semiconductor component are contacted in a planar manner, the insulation film being used for the planar contact.

The first contacting regions (214) define a plane (S).

The planar face engages the second plane.

Each of the bodies connected in a slip plane has a frontal contact plane (15) transversal to the axis thereof.

The model sections are in contact with one another along a contact plane (4) which is horizontal and planar and which represents the interconnection zone.

The reference plane is the plane defined by the meeting points of cap-holder fit.

The reference plane is defined by the meeting points of the cap-holder fit.

The reference plane is the plane defined by the contact points of the cap-holder fit.