The heat-insulating portion (11) restricts the thermal conduction from the tire (2) to the pin (10).
The evaporation drip tray (44) is arranged without being in contact with the heat source (46), the heat source (46) has a thermal conduction device (58), and the thermal conduction device (48) projects into the receiving chamber (60).
The electrical conductivity of the material (10) is affected by changes in temperature related to thermal conduction into the material (10) through the coating (12).
The apparatus (100) further includes a heat conduction layer (110) coupled to the heat sink (114), a first leg (118) coupled to the heat conduction layer (110), and a second leg (118) coupled to the heat conduction layer (110).
Disclosed is a heat conduction method for a graphite-film heat conductor.
Furthermore, heat conduction from the surrounding area of the specific heat radiation section (3) to the specific heat radiation section (3) is suppressed by means of the low heat conductive section (6).
The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
A heat pipe includes a metallic heat conduction body (1).
The base structure has a first heat-conducting surface and a second heat-conducting surface to conduct heat therebetween.
The first heat-conducting surface is mountable to a heat-generating component.
The heat-conducting layer (2) is close to the heating layer (1), and the heat-conducting layer (2) is close to the application layer (3).
Heat exchangers are one common application of convective heat transfer modeling4.
The photovoltaic cell may also have heat-conducting channels within an interior of the photovoltaic cell that conduct heat from the interior of the photovoltaic cell to the heat sink.
A plurality of permanent magnets and a plurality of heat conduction members facing the magnetic body arranging plate (700) are arranged on a magnet/heat-conduction-member arranging plate.
A heat sink (56) of dielectric material is in heat conducting relation to the resistance element.
Each primary radiating strip (20) is disposed on a top surface (12) of the heat conduction base (10) and is perpendicular to the top surface (12) of the heat conduction base (10).
Heat conduction portions are disposed at the two ends of the fixed strip.
The generated heat will be conducted and dissipated from the light-emitting diode module through the corresponding heat conducting/dissipating module.
This invention relates to the conduction of heat within the structure of an integrated circuit.
The ultra high heat conduction layer is located between a framework of the radiator and the high heat dissipation layer.
The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer.
The heat conduction body (1) has several parallel arranged micro-pore tubes (2).
This shaft (20) is in heat transfer relationship with the support assembly (26) and is formed from a high thermally conductive material.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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