The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer.

In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.

A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems.

The disclosed cell comprises in one embodiment a conductive plug recessed into the bulk of the substrate, which is coupled to or comprises the enable gate of the cell.