The invention relates to an optoelectronic semiconductor chip, an optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component.

The invention further relates to a corresponding method for producing an opto-electronic component (101).

Furthermore, an optoelectronic component is provided, which comprises such a lens.

An opto-electronic component (20) includes an opto-electronic device (170) of either the edge or the surface (176) active type mounted on a pedestal (174).

A first, light-reflecting casting (110) covers the region of the carrier (102) enclosing the optoelectronic component (104), at least in regions, and the side surfaces (112) of the optoelectronic component (104).

An optoelectronic device receptacle having a flexible circuit (60) and an optoelectronic semiconductor component (50) mounted thereto is also disclosed in the present invention.

Optical fibers are connected to a component, such as an opto-electronic component, through the connection slot.

The opto-electronic component is mounted on a surface of the circuit board.

Furthermore, the invention relates to an optoelectronic component and to a street lamp having a luminescent substance mixture.

An optoelectronic semiconductor component is provided for mounting to the flexible circuit.

Furthermore, the invention relates to an advantageous method for producing such an optoelectronic component.

The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine.

An optoelectronic component (100) comprises a substrate (102) and a transparent cover (106) in which a cavity (108) is formed.

The optoelectronic component (104) has a substrate (106) and a light emitting layer (108) arranged on the substrate (106).

The wall protrudes from the surface of the circuit board and surrounds the opto-electronic component.