A precursor of a metal compound is formed from a material source of the metal compound, and the precursor of the metal compound and the carbon mixture are fired.
In another embodiment, the at least one metal compound is a metal oxide compound.
The inorganic compound can decompose into a metal compound.
Furthermore, an iron-based compound is used as the metal compound.
The composition comprises a metal compound, a mercapto compound and an olefinic compound.
The metal compound is a metal ion having complexing properties and a polymer containing groups and/or atoms forming a complex with the metal ion.
A metal compound is added to the solvent to form a metal nanowire.
A precursor of a metallic compound is formed from a material source of the metallic compound, and a mixture of the precursor for the metallic compound and a carbon material is fired.
The metallic compound (B) is at least one type of compound selected from the group consisting of an organic acid metal salt and a metal alkoxide.
The base layer (102) and the metal compound layer (103) are heat-treated to diffuse a metal element of the metal compound included in the metal compound layer (103) into the base layer (102).
Preferably, an alkali metal salt of carbonic acid is used as the basic compound; preferably, an aprotic solvent is used as the solvent; and preferably, a metal hydroxide is used as the metal compound that generates water.
It is also preferred that the metal element (B) is contained in the form of a metal compound.
Preferably, an alkali metal salt of carbonic acid is used as the basic compound; preferably, an aprotic solvent is used as the solvent; and preferably, a metal hydroxide is used as the metal compound that generates water.
A method for converting a ligated-metal into chemical components of the ligated-metal includes forming an ionized zone that can convert the ligated-metal to a reduced ligated-metal intermediate.
This method results in the deposition of high quality, substantially uniform films, Additionally, the method makes efficient use of the metal compound component and reduces the cost for the deposition of the metal compound.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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