A method and apparatus for mounting microchips (3) into Printed Circuit Boards (PCB) 1 is described.
A high thermal conductivity printed circuit board (PCB) and making method thereof is provided, so that the problem about heat dissipation of heating element on the PCB can be resolved.
The PCB 1 is provided with a cavity (2) into which the microchip (3) is mounted.
The DC power source includes a battery.
An antenna (36) may be located on a surface of the housing and attached to the circuit board.
The vent cover may also include a circuit board (34) attached to the DC power source.
The circuit board may include a satellite antenna interface for a satellite antenna and a global positioning system (GPS) module attached to the satellite antenna interface.
Requêtes fréquentes français :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
Requêtes fréquentes anglais :1-200, -1k, -2k, -3k, -4k, -5k, -7k, -10k, -20k, -40k, -100k, -200k, -500k, -1000k,
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